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| VCSEL-based self-mixing sensors for biomedical applications |
| | VCSEL-based self-mixing sensor for measurement of displacement and blood perfusion |
| Keywords: | Self mixing, Vertical-Cavity Surface-Emitting Lasers |
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| Optical Interconnects using Arrays of Vertical-Cavity Surface-Emitting Lasers |
| | This project is concerned with the design and implementation of free-space optical interconnects instead of conventional copper wire type interconnects commonly used in the current computer technology. The advantage of optical interconnects investigated in this project is that they would allow higher operational speed (GB/s), better Bit-Error-Ratio (BER), and reduced power consumption in comparison with the existing electrical interconnects in current computer systems. The outcome of this project is to develop design oriented models for microchannel and hybrid optical interconnect architectures based on Vertical-Cavity Surface-Emitting Laser (VCSEL) arrays. |
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| Design and Modelling of Organic Microcavity Light Emitting Diodes |
| | Project is aiming at modelling, design, growth and optimisation of novel organic light emitting structures. Project is being conducted in collaboration with group at The University of Hong-Kong, Hong-Kong, China and draws on our earlier successful work on III_V and II-VI compound semiconductor materials for surface-normal light emitters. |
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| Automated Techniques for Optical & Electrical Characterisation of Vertical-Cavity Surface-Emitting Lasers & 2D VCSEL Arrays |
| | We have developed a sophisticated novel system for comprehensive testing of light emitters used in optical communication and sensing systems. Our system allows for electrical (DC and RF) and optical measurements on semiconductor lasers such as Light-Current, Current-Voltage, optical spectrum, intensity noise spectrum and CCD camera beam profiling. System allows for spectrally, spatially and polarization resolved imaging of coexisting transverse modes in surface-normal and in-plane light emitters. The addition of a new group of on-wafer RF measurements to this system is currently underway to enable measurements on unpackaged devices at high frequencies. |
